Samsung Reportedly Overhauls 1c DRAM Process to Enhance Yield Rates, Influencing HBM4 Development

Samsung is reportedly taking steps to redesign its sixth-generation 1c DRAM. The goal? To boost yield rates and gain a competitive edge in their forthcoming HBM4 process.

### Samsung’s 1c DRAM: A Critical Component for HBM4 Success and Memory Market Strategy

The tech giant from Korea is now considering a revamp of its 1c DRAM process, which is a pivotal element for the success of its next-gen HBM4. As noted by ZDNet Korea, Samsung has been re-evaluating its advanced DRAM designs since the second half of 2024. The company has decided to overhaul its high-end 1c DRAM design to ensure smoother adoption of its HBM solutions in the industry—an area where the earlier HBM3 faced significant hurdles, notably with big players like NVIDIA.

A source illustrated that the cutting-edge DRAM process by Samsung was falling short of expected yield rates—hovering around just 60% to 70%. This shortfall halted the leap to mass production. The challenge primarily lies in the 1c DRAM chip’s size. Initially, Samsung attempted to shrink the chip size for higher production volumes, but such a strategy compromised the process’s stability and led to lower yield rates.

> “Samsung Electronics has altered its 1c DRAM design to enlarge chip size, prioritizing improved yields by mid-year. They seem determined to achieve stable mass production of their next-gen memory, even at higher costs.”
> — ZDNet Korea

This 1c DRAM process is significant for the eventual success of Samsung’s HBM4 products. Meanwhile, rivals like SK Hynix and Micron have already polished their designs, which puts Samsung on a tight timeline. The company’s reputation took a hit after the HBM3 difficulties, adding more pressure to get the 1c DRAM right and meet industry standards this time around.

There’s a cloud of uncertainty around the outcome of Samsung’s sixth-generation DRAM process. However, indications suggest that progress may unfold over the coming months. Should things go well, Samsung’s HBM4 process could potentially enter mass production by year’s end, marking a pivotal moment for the memory business.